Brush Plating, also known as selective plating, portable electroplating or electroplating on-site, is a specialized surface treatment technique that involves applying a thin layer of metal onto a target area.
Unlike traditional electroplating, which submerges the entire component in a bath of plating solution, Brush Plating is a highly precise method that targets specific areas of the component, making it ideal for localized repairs, enhancements and modifications.
Its humble beginning saw the development from a quick, touch-up for correction of plating defects, to becoming an integral part of the restoration process in many industries.
Brush plating allows targeted plating on specific areas in-situ, eliminating the need for excessive masking or intricate disassembly processes and avoiding the complexities of transporting large or anchored components. This quick and efficient plating process minimizes handling, accelerates production, and reduces labour costs.
Brush plating technology is portable due to its simple and compact design. The lightweight and versatile setup allows for easy transportation, enabling on-site plating and reducing the need for component disassembly, making it highly convenient and efficient.
Brush Plating allows accurate metal deposition on specific areas, avoiding the need for complete immersion like Bath Plating. This targeted approach saves time and effort, reduce unnecessary material cost and waste.
Brush plating technology allows precise and controlled thickness by regulating the deposition rate through adjustable parameters such as current density, plating time, and solution flow.
Brush Plating offers controlled deposition and uses specialized low-hydrogen chemical solutions, reducing the risk of hydrogen embrittlement. Unlike bath electroplating, it minimizes hydrogen absorption, ensuring better mechanical integrity of the plated surface.
Brush Plating is relatively simple to learn and can be performed by personnel with the relevant training, making it accessible to various industries.
Brush Plating uses a targeted approach that avoids exposing the entire mechanical component to the plating solution, ensuring that sensitive or delicate parts remain unaffected by the plating process, minimizing the risk of contamination.
Superior in many aspects while compared to other forms of repair methods such as Welding, Tank Plating and even Metallizing.
It is a far better choice for cost-effective, localized surface treatments and enhancements.
Brush plating is an electrolytic process that requires the presence of four crucial elements – Anode, Cathode, Potential and Electrolyte. Each element must be present to ensure a smooth and successful plating process.
The process generally begins with the preparation of the substrate or component, which involves thorough cleaning to ensure it is free from contaminants as well as provide proper masking around the area. The anode also known as a Brush Plating wand, is then used to apply the plating solution directly onto the targeted area. The anode delivers a controlled current to initiate the electrochemical reaction, causing the metal ions in the solution to bond with the substrate, forming a seamless and adherent layer.
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